Detailed explanation of the application of silicon wafer single-sided thinning equipment


The outer side of the circular fixing plate is provided with a concentric rotating shaft supported on the bracket, the concentric rotating shaft is connected with a drive motor arranged on the outer side of the box body by a transmission mechanism, and the box body is also provided with a corrosion resistant for heating and cooling Circulating water pipe. In the silicon wafer thinning and bleaching machine, the circular fixing plate is provided with a circular device hole corresponding to the position of three of the four basket lifting rods, and a U-shaped device slot corresponding to the position of the remaining basket lifting rod, so as to facilitate the taking and placing of silicon wafers.

 

The silicon wafer thinning and bleaching machine, the bracket is provided with a U-shaped groove corresponding to a concentric rotating shaft, the concentric rotating shaft is supported at the bottom of the U-shaped groove, and the rotating basket is placed at the same time. In the silicon wafer thinning and bleaching machine, the transmission mechanism is composed of a driven bevel gear arranged on a concentric rotating shaft and a driving bevel gear meshing with the driven bevel gear. The driving bevel gear applies a coupling and The end of the output shaft of the drive motor is connected, and the drive motor is inverted on the top of the box.

The silicon wafer thinning and bleaching machine, the corrosion-resistant circulating water pipe is serpentine arranged along the inner wall of the box body. After the rotating basket drives the silicon wafer to rotate in the box with acid solution, the rotation completes the thinning at the same time, the average, repeatability and stability of the original silicon wafer are effectively controlled, and the final rejection rate is improved.

Through the corrosion-resistant circulating water pipe for heating and cooling set in the box body, the acid temperature measurement and acid temperature control are completed, which prevents the floating glue phenomenon formed by too high acid temperature. If the acid temperature is too low, the silicon wafer has slow corrosion speed and uneven bleaching, which ensures the corrosion reaction to meet the corrosion efficiency and average of the design calculation requirements. As the basket rod is evenly provided with multiple radial annular grooves along its length, it can complete a large number of silicon wafers at the same time, complete the bulk consumption of silicon wafer thinning.

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