Introduction to the main functions of thinning equipment

Silicon wafer single-sided thinning technology is mainly applied to the consumption process of 6500V high voltage series silicon controlled rectifier, rectifier diode and high density diode. The function of single-sided thinning is to improve the surface millivolt of silicon wafer single-sided, so as to facilitate the smooth completion of the next phosphorus diffusion process. At present, other domestic enterprises are using conventional thinning process, that is, grinding machine thinning.


It has the following problems: the average of thinning is poor, the thickness of subtraction is difficult to accurately control, easy to fragment, and after carborundum grinding, and the introduction of impurities, the formation of silicon outside the statement is difficult to control. The purpose of this creation is to provide a reasonable structural design to deal with the above problems, simple operation of silicon wafer chemical thinning equipment, the completion of silicon wafer single-sided chemical thinning, not only the consumption of large quantities, but also the progress of the scrap rate, save resources, reduce consumption costs.

The technical plan of this creation is: a silicon wafer chemical thinning equipment, including a box containing mixed acid liquid, characterized in that: the bottom of the box is fixed with a degree support plate using an upright column, and the degree support plate is fixed with a gas Bubbling box and the degree support plate is provided with matrix bubble through holes communicating with the gas bubbling box, A bracket is arranged above the degree support plate, and a rotating basket for clamping the silicon wafer is supported on the bracket.

The rotating basket is composed of two circular fixing plates and four basket lifting rods arranged laterally between the two circular fixing plates. The four basket lifting rods are evenly distributed with the center line of the circular fixing plate as the symmetrical center. The basket lifting rod is evenly provided with a plurality of radial annular grooves along its length direction, and the radial annular grooves of the four basket lifting rods correspond to each other and form a plurality of vertical silicon chip clamping grooves.

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