Polishing Process of Plane Polishing Machine


The polishing process of the plane polishing machine uses the relative movement of free granular abrasive on the processed surface of the workpiece and the base surface of the grinding disc to make the surface of the workpiece become very high flatness and smoothness. The workpiece does not need strong clamps, vacuum and magnets to fix, but is naturally placed on the grinding disc, which is basically suitable for processing workpieces of any metal and non-metal materials. The mirror grinding machine does not have mandatory clamping and rigid grinding of general grinding machines, it reduces the secondary deformation caused by impact and heat generation, and is more conducive to high-precision and high-finish processing. Even an inexperienced operator can easily use a mirror grinder to obtain a flatness of 0.2um and a roughness of Ra0.02um.
 
Plane polishing machine is mainly used for silicon wafer, gallium arsenide wafer, ceramic wafer, quartz crystal, photoelectric glass and other hard and brittle materials of double-sided high-precision grinding and polishing. Through the controller, the high frequency electric vibration is generated and transmitted to the transducer. The transducer converts the input super audio signal into mechanical vibration, amplifies it by the horn, and transmits it to the tool head mounted on the horn, and then drives the diamond or abrasive suspension attached to the tool head to rub the workpiece at high speed, resulting in the rapid reduction of the surface roughness of the workpiece until the mirror surface, thus realizing the polishing function.

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