Talk about the application technology of thinning machine

The single-sided thinning skill of silicon wafer is mainly used in the consumption process of 6500V high-voltage series silicon controlled rectifier, rectifier diode and high-density diode. The function of single-sided thinning is to advance the external millivolt of the single-sided silicon wafer so as to facilitate the smooth completion of the next phosphorus diffusion process. At present, other domestic enterprises are using conventional thinning process, that is, grinding machine thinning.


It has the following problems: the average of thinning is poor, the thickness of subtraction is difficult to accurately control, simple fragments, and after carborundum grinding, and the introduction of impurities, it is difficult to control the external statement of the silicon wafer. The purpose of the invention is to provide a reasonable structural planning to deal with the above-mentioned problems, simple operation of silicon wafer chemical thinning equipment, the end of the silicon wafer single-sided chemical thinning, not only the consumption of large quantities, and forward the scrap rate, save resources, reduce consumption costs.

The technical scheme of the present invention is: a silicon wafer chemical thinning equipment, comprising a box body containing a mixed acid liquid, characterized in that: the bottom surface of the box body is fixed with a degree support plate using a column, and the degree support plate is fixed below The gas bubbling box and the degree supporting plate are provided with matrix-shaped bubble through holes communicating with the gas bubbling box, A bracket is arranged above the degree support plate, and a rotating basket for clamping the silicon wafer is supported on the bracket.

The rotating basket is composed of two circular fixing plates and four basket rods laterally arranged between the two circular fixing plates. The four basket rods are evenly distributed with the center line of the circular fixing plate as the symmetrical center. The basket rod is evenly provided with a plurality of radial annular grooves along its length direction, and the radial annular grooves of the four basket rods correspond to each other and form a plurality of vertical silicon chip clamping grooves.

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